
China semiconductor packaging player gets Series B extension

Chinese semiconductor packaging specialist Jiangsu Jing Chuang Advanced (JCA) Electronic Technology has raised a Series B extension of several hundreds of million renminbi led by Qiming Venture Partners.
Other investors are mostly state-backed institutions, including Shenzhen Capital Group, Suzhou International Development Venture Capital, Changshu Guofa Venture, Changshu Jingkai Guofa, Nanjing Nil Group, and Soochow Investment.
Founded in 2013, JCA focuses on cutting equipment for semiconductors. It claims particular expertise in 12-inch automatic precision scribing machines.
The company is headquartered in Changshu National New & Hi-tech Industrial Development Zone, hence the swath of local investors. Changshu is an important manufacturing base in the Yangtze River Delta. JCA claims the location is advantageous because it allows easy access to customers.
Packaging is an essential part of the semiconductor manufacturing process. A chip is cast in silicon - or fabricated - by foundries and then a packaging specialist encapsulates semiconductor material in a case that prevents physical damage. The case holds the semiconductor die and connects the chip to a board.
After the packaging phase, semiconductor testing companies assess chip performance. Packaging impacts performance as well as power, cost, and basic functionality.
At present, China’s packaging equipment industry is monopolised by foreign brands. The localisation rate for scribing machines is still less than 10%, according to Kuaitai Yeh, a partner at Qiming. JCA’s products have entered mass production and the company now serves China’s leading packaging factories.
"In the next few years, China's new 12-inch semiconductor wafer production capacity will be among the world's largest, the demand for relevant semiconductor production equipment will amount close to 30% of the world, which gives Chinese manufacturers a huge space for development,” said Yeh in a statement.
JCA will use the new funding for the development of new products, manufacturing capacity expansion, and marketing and brand building.
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