China semiconductor player Eswin Material raises $576m
Eswin Material, the integrated circuit manufacturing unit of Eswin Technology Group, has raised CNY 4bn（USD 576m）in Series C funding led by the New Materials Fund of China National Building Material.
Other investors include Yufu Holding, Beijing-based Financial Street Capital Group, China Fortune-Innovation Capital, Source Code Capital, SDIC Venture Capital, Guangtou Capital Management Group, and Hudson...
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